Chepaume

Chepaume is currently developing a new type of frame which will use bi-directional tension. This will allow for vector printing of solder paste, improving solder paste deposition within fine pitch apertures.


	The Future of Chepaume Industries... Chepaume is currently developing a new type of frame which will use bi-directional tension. This will allow for vector printing of solder paste, improving solder paste deposition within fine pitch apertures. back

The Future of Chepaume Industries...