Nickel Electroformed Stencils

To meet the most demanding requirements, involved in consistently achieving the best results for fine pitched printing technology, Chepaume Industries and their parent company, Newcut Inc. have developed their nickel electroformed stencils(NES).

The smooth, tapered aperture walls offer the best paste release characteristics available which, when combined with the surface properties of Nickel, maximize both the solder paste deposit and its release, even from the finest of stencil apertures. 

Our Electroformed stencils are processed to be stronger and harder than conventional stainless steel stencil, resulting in longer life and improved wear even when using hard urethane or stainless steel squeegee blades.

Squeegee side surface finish plays an important role in maintaining paste rheology. The unique pattern on the NES has been developed to ensure the solder paste will roll and not skid across the stencil with the progression of the squeegee blade. Thereby providing the ideal conditions for each and every print. 

Electroformed stencils are available in any thickness up to 0.200 mm. Stencils are also produced for Flip Chip technology products in the range of 0.025 to 0.100 mm and are generally meshed into frames.

Many electronics and surface mount specialist companies now recognize and agree that electroformed stencils offer the best solution available for solder paste deposition in fine and ultrafine pitch printing.

Electroforming Technology

The electroforming process consists of electrochemically growing metal shapes atom by atom.

The process begins when photoresist is polymerized by exposure to UV light through a phototool of the PCB image pattern. 

After developing, a negative image is created on the mandrel where only pillars of resist, representing the apertures required, remain.

The stencil is then grown on the mandrel over time by Nickel Electroforming. Time and current determine the thickness of the finished stencil.

Any remaining photoresist is then removed from the apertures and the foil is then separated from the mandrel.

Multi-Level Electroform

In response to the problem of applying solder paste for both surface mount connectors and finer pitch components without excess solder deposits that may cause bridging, Chepaume Industries has developed Multi Level Electroformed stencils. (MLE).

Advantages of Electroforming

  • Elimination of side to side misalignment 
  • Stencils reproduced from first generation tooling ensures aperture and image accuracy. 
  • The aperture geometry provides excellent paste release characteristics with lower surface tension that results in maximized solder paste deposits. 
  • The increased strength and hardness of electroformed products means they last longer and can be used with any type of squeegee or blade 
  • Electroforms are produced as traditional meshed stencils 
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